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  low skew, 1-to-2 lvcmos / lvttl fanout buffer w/ complementary output 8302i-01 data sheet d escription the 830 2i-01 is a low skew, 1-to-2 lvcmos/lvttl fanout buffer w/complementary output. the 8302i-01 has a single ended clock input. the single ended clock input accepts lvcmos or lvttl input levels. the 8302i-01 is characterized at full 3.3v for input v dd , and mixed 3.3v and 2.5v for output operating supply modes (v ddo ). guaranteed output and part-to-part skew characteristics make the 8302i-01 ideal for clock distribution applications demanding well de? ned performance and repeatability . f eatures complementary lvcmos / lvttl output l vcmos / lvttl clock input accepts lvcmos or lvttl input levels maximum output frequency: 250mhz output skew: 165ps (maximum) part-to-part skew: 800ps (maximum) small 8 lead soic package saves board space full 3.3v or 3.3v core/2.5v output supply modes -40? to 85? ambient operating temperature available in lead-free compliant package b lock d iagram pin assignments 8302i-01 8-lead soic 3.8mm x 4.8mm, x 1.47mm package body m package top view v ddo v dd clk gnd 1 2 3 4 q nq clk q gnd v ddo nq 8 7 6 5 1 ?2017 integrated device technology, inc. may 4, 2017
t able 1. p in d escriptions t able 2. p in c haracteristics number name type description 1, 6 v ddo power output supply pins. 2v dd power power supply pin. 3 clk input pulldown lvcmos / lvttl clock input. 4,7 gnd power power supply ground. 5 nq output complementary clock output. lvcmos / lvttl interface levels. 8 q output clock output. lvcmos / lvttl interface levels. note: pulldown refer to internal input resistors. see table 2, pin characteristics, for typical values. symbol parameter test conditions minimum typical maximum units c in input capacitance 4 pf c pd power dissipation capacitance (per output) v dd , v ddo = 3.465v 22 pf v dd = 3.465v, v ddo = 2.625v 16 pf r pulldown input pulldown resistor 51 k r out output impedance 5 7 12 2 ?2017 integrated device technology, inc. may 4, 2017 8302i-01 datasheet
t able 3a. p ower s upply dc c haracteristics , v dd = 3.3v?%, v ddo = 3.3v?% or 2.5v?%, t a = -40? to 85? t able 3b. lvcmos / lvttl dc c haracteristics , v dd = 3.3v?%, v ddo = 3.3v?% or 2.5v?%, t a = -40? to 85? a bsolute m aximum r atings supply voltage, v dd 4.6v inputs, v i -0.5v to v dd + 0.5 v outputs, v o -0.5v to v ddo + 0.5v package thermal impedance, ja 112.7?/w (0 lfpm) storage temperature, t stg -65? to 150? no te: stresses beyond those listed under absolute maximum ratings may cause permanent damage to the de vic e. t hese ratings are stress speci cations only . functional operation of product at these conditions or any conditions beyond those listed in the dc characteristics or ac charac-teristics is not implied. exposure to absolute maximum rating conditions for extended periods may affect product reliability. symbol parameter test conditions minimum typical maximum units v ih input high voltage 2 v dd + 0.3 v v il input low voltage -0.3 0.8 v i ih input high current clk v dd = v in = 3.465v 150 ? i il input low current clk v dd = 3.465v, v in = 0v -5 ? v oh output high voltage v ddo = 3.465, 50 to v ddo /2 2.6 v v ddo = 3.465, i oh = -100? 2.9 v v ddo = 2.625, 50 to v ddo /2 1.8 v v ddo = 2.625, i oh = -100? 2.2 v v ol output low voltage v ddo = 3.465, 50 to v ddo /2 0.5 v v ddo = 3.465, i ol = 100? 0.2 v v ddo = 2.625, 50 to v ddo /2 0.5 v v ddo = 2.625, i ol = 100? 0.2 v symbol parameter test conditions minimum typical maximum units v dd power supply voltage 3.135 3.3 3.465 v v ddo output power supply voltage 3.135 3.3 3.465 v 2.375 2.5 2.625 v i dd power supply current 13 ma i ddo output supply current 4ma 3 ?2017 integrated device technology, inc. may 4, 2017 8302i-01 datasheet
t able 4b. ac c haracteristics , v dd = 3.3v?%, v ddo = 2.5v?%, t a = -40? to 85? t able 4a. ac c haracteristics , v dd = v ddo = 3.3v?%, t a = -40? to 85? symbol parameter test conditions minimum typical maximum units f max output frequency 250 mhz tp lh propagation delay, low-to-high; note 1 1.8 2.7 ns t sk(o) output skew; note 2, 4 165 ps t sk(pp) part-to-part skew; note 3, 4 800 ps t r / t f output rise/fall time 20% to 80% 300 800 ps odc output duty cycle ? 133mhz 45 55 % 133mhz < ? 250mhz 40 60 % note 1: measured from v dd /2 of the input to v ddo /2 of the output. note 2: de ned as skew between outputs at the same supply voltage and with equal load conditions. measured at v ddo /2. note 3: de ned as skew between outputs on different devices operating at the same supply voltages and with equal load conditions. using the same type of inputs on each device, the outputs are measured at v ddo /2. note 4: this parameter is de ned in accordance with jedec standard 65. symbol parameter test conditions minimum typical maximum units f max output frequency 250 mhz tp lh propagation delay, low-to-high; note 1 1.9 2.9 ns tsk(o) output skew; note 2, 4 250 ps tsk(pp) part-to-part skew; note 3, 4 900 ps t r / t f output rise/fall time 20% to 80% 100 850 ps odc output duty cycle ? 133mhz 45 55 % 133mhz < ? 250mhz 40 60 % note 1: measured from v dd /2 of the input to v ddo /2 of the output. note 2: de ned as skew between outputs at the same supply voltage and with equal load conditions. measured at v ddo /2. note 3: de ned as skew between outputs on different devices operating at the same supply voltages and with equal load conditions. using the same type of inputs on each device, the outputs are measured at v ddo /2. note 4: this parameter is de ned in accordance with jedec standard 65. 4 ?2017 integrated device technology, inc. may 4, 2017 8302i-01 datasheet
p arameter m easurement i nformation 3.3v/2.5v o utput l oad ac t est c ircuit 3.3v c ore /3.3v o utput l oad ac t est c ircuit p ropagation d elay p art - to -p art s kew o utput r ise /f all t ime o utput s kew o utput d uty c ycle /p ulse w idth /p eriod 5 ?2017 integrated device technology, inc. may 4, 2017 8302i-01 datasheet
t ransistor c ount the transistor count for 8302i-01 is: 322 t able 5. ja vs . a ir f low t able for 8 l ead soic ja by velocity (linear feet per minute) 0 200 500 single-layer pcb, jedec standard test boards 153.3?/w 128.5?/w 115.5?/w multi-layer pcb, jedec standard test boards 112.7?/w 103.3?/w 97.1?/w note: most modern pcb designs use multi-layered boards. the data in the second row pertains to most designs. r eliability i nformation 6 ?2017 integrated device technology, inc. may 4, 2017 8302i-01 datasheet
7 ?2017 integrated device technology, inc. may 4, 2017 package drawing 8302i-01 datasheet
8302i-01 datasheet 8 ?2017 integrated device technology, inc. may 4, 2017 disclaimer integrated device te chnology, inc. (idt) and its aff iliated companies (herein referred to as ?idt?) reserve the right to modify the products and/or specific ations described herein at any time, without notice, at idt?s sole discretion. performance specifications and operati ng parameters of the described products are det ermined in an independent state and are not guaranteed to perform the same way when installed in customer products. the informati on contained herein is provided without representation or warranty of any kind, whether express or implied, incl uding, but not limited to, the suitability of idt's products for any particular purpose, an implied warran ty of merchantability, or non-infringement of the intellectual p roperty rights of others. this documen t is presented only as a guide and does not convey any license under intellectual propert y rights of idt or any third parties. idt's products are not intended for use in applications involvi ng extreme environmental conditions or in life support systems o r similar devices where the failure or malfunction of an idt product can be rea- sonably expected to significantly affect the health or safety of users. anyone using an idt product in such a manner does so at their own risk, absent an express, written agreement by idt. integrated device technology, idt and the idt logo are trademarks or registered trademarks of idt and its subsidiaries in the united states and other c ountries. other trademarks used herein are the property of idt or their respective third party owners. for datas heet type definitions and a glossary of common terms, visit www.idt.com/go/glossary . integrated device technology, inc.. all rights reserved. tech support www.idt.com/go/support sales 1-800-345-7015 or 408-284-8200 fax: 408-284-2775 www.idt.com/go/sales corporate headquarters 6024 silver creek valley road san jose, ca 95138 usa www.idt.com ordering information revision history orderable part number marking package carrier type temperature 8302AMI-01LF 302ai01l 3.8 x 4.8 x 1.47 mm 8-soic tube -40 to +85c 8302AMI-01LF 302ai01l 3.8 x 4.8 x 1.47 mm 8-soic tape and reel -40 to +85c revision date description of change may 4, 2017 ? corre cted and updated the ordering in f orma tion table. ? upd ated package informatio n. ? updated datasheet heade r/footer. march 9, 2016 ? features section - removed reference to leaded package ? ordering information table - removed quantity from tape and reel. deleted lf note below table. ? added contact page july 29, 2010 ? updated datasheet header/footer with idt logo from ics logo. ? ordering information table - removed ics prefix from part/order number column. ? added contact page.


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